Impera yimbere yumurongo (FEOL): Gushiraho Urufatiro

Imbere, hagati na nyuma yinyuma ya semiconductor ikora imirongo itanga umusaruro

Igikorwa cyo gukora igice cya kabiri kirashobora kugabanywa mubice bitatu:
1) Impera yumurongo
2) Impera yumurongo
3) Impera yumurongo

Turashobora gukoresha ikigereranyo cyoroshye nko kubaka inzu kugirango tumenye inzira igoye yo gukora chip:

Impera yimbere yumusaruro ni nko gushiraho urufatiro no kubaka inkuta zinzu. Mu gukora semiconductor, iki cyiciro kirimo gukora ibyingenzi na tristoriste kuri wafer ya silicon.

Intambwe Zingenzi ZUBUNTU:

1.Gusukura: Tangira ukoresheje wafer yoroheje ya silicon hanyuma uyisukure kugirango ukureho umwanda wose.
2.Oxidation: Gukura urwego rwa dioxyde ya silicon kuri wafer kugirango utandukanye ibice bitandukanye bya chip.
3.Amafoto: Koresha Photolithography kugirango ushushanye kuri wafer, bisa no gushushanya igishushanyo mbonera.
4.Gukora: Kuramo dioxyde ya silicon idakenewe kugirango ugaragaze imiterere wifuza.
5.Doping: Shyira umwanda muri silicon kugirango uhindure imiterere yumuriro wamashanyarazi, ukore transistor, ibice byubaka byibanze bya chip.

Hagati yumurongo wo hagati (MEOL): Guhuza Utudomo

Impera yo hagati yumurongo wibyakozwe ni nko gushiraho insinga n'amazi mumazu. Iki cyiciro cyibanze ku gushiraho amasano hagati ya tristoriste yakozwe murwego rwa FEOL.

Intambwe z'ingenzi za MEOL:

1.Delectric Deposition: Kubitsa ibyiciro (bita dielectrics) kugirango urinde transistors.
2.Guhuza imikoranire: Shiraho umubano kugirango uhuze tristoriste hamwe nisi yo hanze.
3.Guhuza: Ongeraho ibyuma kugirango ukore inzira zerekana ibimenyetso byamashanyarazi, bisa no kwifuza inzu kugirango umenye ingufu zitagira ingano namakuru atemba.

Inyuma Yumurongo (BEOL): Kurangiza Gukoraho

Impera yinyuma yumurongo wibikorwa ni nko kongeramo ibintu bya nyuma munzu - gushiraho ibikoresho, gushushanya, no kwemeza ko byose bikora. Mu gukora semiconductor, iki cyiciro kirimo kongeramo ibice byanyuma no gutegura chip yo gupakira.

Intambwe z'ingenzi za BEOL:

1.Icyuma cy'inyongera: Ongeraho ibyuma byinshi kugirango wongere imikoranire, urebe ko chip ishobora gukora imirimo igoye n'umuvuduko mwinshi.
2.Passivation: Koresha ibice birinda kugirango ukingire chip kwangiza ibidukikije.
3.Gupima: Shyira chip kubizamini bikomeye kugirango urebe ko byujuje ibisobanuro byose.
4.Gushushanya: Kata wafer muri chip imwe, buriwese yiteguye gupakira no gukoresha mubikoresho bya elegitoroniki.

Semicera nu ruganda rukora OEM mu Bushinwa, rwihaye guha agaciro kadasanzwe abakiriya bacu. Dutanga urutonde rwuzuye rwibicuruzwa na serivisi byujuje ubuziranenge, harimo:

1.CVD SiC.
2.CVD SiC Ibice byinshi(Impeta ya Etch, impeta yibanze, ibikoresho bya SiC byabigenewe ibikoresho bya semiconductor, nibindi byinshi)
3.CVD TaC Ibice Bitwikiriye(Epitaxy, gukura kwa WaC, ubushyuhe bwo hejuru, nibindi byinshi)
4.Ibice bishushanyo(Ubwato bwa Graphite, ibikoresho bya grafite byabugenewe byo gutunganya ubushyuhe bwo hejuru, nibindi byinshi)
5.Ibice bya SiC(Ubwato bwa SiC, itanura rya SiC, ibikoresho bya SiC byabugenewe byo gutunganya ibikoresho bigezweho, nibindi byinshi)
6.Ibice bya Quartz(Ubwato bwa Quartz, ibice bya quartz byabigenewe bya semiconductor ninganda zizuba, nibindi byinshi)

Ibyo twiyemeje kuba indashyikirwa byemeza ko dutanga ibisubizo bishya kandi byizewe mu nganda zinyuranye, harimo gukora inganda ziciriritse, gutunganya ibikoresho bigezweho, hamwe n’ikoranabuhanga rikoresha tekinoroji. Hamwe no kwibanda kubisobanuro nubuziranenge, twiyemeje guhaza ibyifuzo byihariye bya buri mukiriya.