Kwiga kuri semiconductor bipfainzira yo guhuza, harimo uburyo bwo guhuza ibintu, uburyo bwo guhuza eutectic, uburyo bworoshye bwo kugurisha ibicuruzwa, uburyo bwo guhuza ifeza, uburyo bwo guhuza ibicuruzwa bishyushye, uburyo bwo guhuza ibicuruzwa. Ubwoko nibimenyetso byingenzi bya tekiniki byerekana ibikoresho bya semiconductor bipfa guhuza ibikoresho, iterambere ryarasesenguwe, kandi iterambere rirateganijwe.
1 Incamake yinganda ziciriritse nogupakira
Inganda za semiconductor zirimo cyane cyane ibikoresho bya semiconductor ibikoresho nibikoresho, ibikoresho bya semiconductor hagati, hamwe na porogaramu zo hasi. inganda zanjye zikoresha igice cya kabiri cyatangiye bitinze, ariko nyuma yimyaka hafi icumi yiterambere ryihuse, igihugu cyanjye cyahindutse isoko ry’ibicuruzwa bikoresha imashanyarazi nini ku isi ndetse n’isoko ry’ibikoresho bya semiconductor nini ku isi. Inganda za semiconductor zateye imbere byihuse muburyo bwigisekuru kimwe cyibikoresho, igisekuru kimwe cyibikorwa, hamwe nigisekuru cyibicuruzwa. Ubushakashatsi bwibikorwa bya semiconductor hamwe nibikoresho nizo mbaraga zingenzi ziterambere ryiterambere ryinganda ningwate yinganda n’umusaruro mwinshi w’ibicuruzwa byifashishwa.
Amateka yiterambere rya tekinoroji ya semiconductor ni amateka yo gukomeza kunoza imikorere ya chip hamwe na miniaturizasi ya sisitemu. Imbaraga zimbere zikoranabuhanga ryo gupakira zahindutse kuva murwego rwa terefone zohejuru zo mu rwego rwo hejuru zijya mu bice nka comptabilite ikora cyane hamwe nubwenge bwa artile. Ibyiciro bine byiterambere ryiterambere rya tekinoroji ya semiconductor irerekanwa mumeza 1.
Mugihe inzira ya semiconductor ya lithographie yimikorere igenda yerekeza kuri 10 nm, 7 nm, 5 nm, 3 nm, na 2 nm, R&D nibiciro byumusaruro bikomeje kwiyongera, igipimo cyumusaruro kiragabanuka, kandi amategeko ya Moore aratinda. Duhereye ku majyambere y’iterambere ry’inganda, kuri ubu akumirwa n’imipaka igaragara y’ubucucike bwa transistor hamwe n’izamuka ryinshi ry’ibiciro by’inganda, gupakira biratera imbere mu cyerekezo cya miniaturizasi, ubucucike bukabije, imikorere myinshi, umuvuduko mwinshi, inshuro nyinshi, no kwishyira hamwe kwinshi. Inganda za semiconductor zinjiye mu bihe bya nyuma ya Moore, kandi inzira zateye imbere ntizikibanda gusa ku iterambere ry’imikorere y’ikoranabuhanga rya wafer, ahubwo buhoro buhoro rihindukirira tekinoroji yo gupakira. Ubuhanga buhanitse bwo gupakira ntibushobora kunoza imikorere no kongera agaciro k'ibicuruzwa, ariko kandi bugabanya neza ibiciro byinganda, biba inzira yingenzi yo gukomeza amategeko ya Moore. Ku ruhande rumwe, tekinoroji yibanze ikoreshwa mugutandukanya sisitemu igoye muburyo butandukanye bwo gupakira ibintu bishobora gupakirwa muburyo butandukanye. Kurundi ruhande, sisitemu ihuriweho na sisitemu ikoreshwa muguhuza ibikoresho byibikoresho bitandukanye, bifite inyungu zidasanzwe zakazi. Guhuza ibikorwa byinshi nibikoresho bitandukanye bigerwaho hifashishijwe ikoranabuhanga rya microelectronics, kandi iterambere riva mumirongo ihuriweho na sisitemu ihuriweho iragerwaho.
Gupakira Semiconductor niyo ntangiriro yo gukora chip hamwe nikiraro hagati yisi yimbere ya chip na sisitemu yo hanze. Kugeza ubu, usibye amasosiyete gakondo apakira no gupakira amasosiyete, semiconductorwaferibishingwe, amasosiyete akora ibishushanyo mbonera, hamwe nisosiyete igizwe nibice bitezimbere bitezimbere cyane bipfunyika cyangwa tekinoroji yingenzi yo gupakira.
Inzira nyamukuru yubuhanga bwo gupakira niwaferkunanura, gukata, gupfa guhuza, guhuza insinga, gufunga plastike, amashanyarazi, gukata imbavu no kubumba, nibindi. Muri byo, inzira yo guhuza imfu nimwe mubikorwa bigoye kandi bipfunyika, kandi ibikoresho byo guhuza bipfa nabyo ni kimwe mubikoresho ibikoresho byingenzi byingenzi mubikoresho bipfunyika, kandi nikimwe mubikoresho bipakira bifite agaciro keza kumasoko. Nubwo tekinoroji yo gupakira yateye imbere ikoresha inzira-yanyuma nka lithographie, etching, metallisation, na planarisation, inzira yingenzi yo gupakira iracyari inzira yo gupfa.
2 Semiconductor ipfa inzira yo guhuza
2.1 Incamake
Igikorwa cyo guhuza urupfu nacyo cyitwa chip gupakira, gupakira ibintu, gupfa bipfa, inzira yo guhuza chip, nibindi. Gahunda yo guhuza imfu irerekanwa mumashusho 1. Muri rusange, guhuza imfu ni ugutora chip muri wafer ukoresheje umutwe wo gusudira. guswera nozzle ukoresheje vacuum, hanyuma ubishyire kumwanya wabigenewe wagenewe ikariso yambere cyangwa gupakira substrate munsi yubuyobozi bugaragara, kugirango chip na padi bihuze kandi bikosorwe. Ubwiza nuburyo bukoreshwa muburyo bwo guhuza bipfa bizagira ingaruka kuburyo butaziguye ubwiza nubushobozi bwo guhuza insinga zizakurikiraho, bityo rero gupfa bipfa ni bumwe muburyo bwingenzi mubikorwa bya semiconductor inyuma-iherezo.
Kubikorwa bitandukanye byo gupakira ibicuruzwa, ubu hariho uburyo butandatu bwingenzi bwo gupfa bupfa, aribwo buryo bwo gufatira hamwe, guhuza eutectic, guhuza ibicuruzwa byoroshye, guhuza ifeza, guhuza ibicuruzwa bishyushye, no guhuza flip-chip. Kugirango ugere kuri chip ihuza neza, birakenewe ko ibintu byingenzi byingenzi mubikorwa byo gupfa bipfa gufatanya, cyane cyane ibikoresho byo guhuza bipfa, ubushyuhe, igihe, igitutu nibindi bintu.
2. 2 Uburyo bwo guhuza ibikorwa
Mugihe cyo gufatira hamwe, umubare munini wibikoresho bigomba gushyirwa kumurongo wambere cyangwa paki ya substrate mbere yo gushyira chip, hanyuma umutwe uhuza urupfu ufata chip, hanyuma ukoresheje icyerekezo cyo kumashini, chip ishyirwa muburyo bwiza. Umwanya wa sisitemu yo kuyobora cyangwa pake substrate yashizwe hamwe na adhesive, kandi imbaraga zimwe zipfa gupfa zikoreshwa kuri chip binyuze mumutwe wimashini ipfa, ikora igipande gifatika hagati ya chip hamwe nicyerekezo cyambere cyangwa pake substrate, kugirango kugirango kugera ku ntego yo guhuza, gushiraho no gutunganya chip. Iyi nzira yo guhuza ipfa nayo yitwa kole ya kole kuko igomba gufatirwa imbere yimashini ipfa.
Ibikoresho bifata cyane birimo ibikoresho bya semiconductor nka epoxy resin na paste ya silver. Guhuza gufatira hamwe nikoreshwa cyane muri semiconductor chip bipfa guhuza inzira kuko inzira iroroshye, igiciro ni gito, kandi ibikoresho bitandukanye birashobora gukoreshwa.
2.3 Inzira yo guhuza Eutectic
Mugihe cyo guhuza eutectic, ibikoresho bya eutectic bihuza muri rusange byabanje gukoreshwa munsi ya chip cyangwa ikadiri yo kuyobora. Ibikoresho byo guhuza eutectic bifata chip kandi ikayoborwa na sisitemu yo kureba imashini kugirango ishyire neza chip kumwanya uhuye nu murongo wo kuyobora. Chip hamwe nuyobora ikadiri ikora eutectic ihuza intera hagati ya chip na pake substrate munsi yibikorwa byo gushyushya hamwe nigitutu. Inzira ya eutectic ihuza akenshi ikoreshwa murwego rwo hejuru hamwe na ceramic substrate packaging.
Ibikoresho byo guhuza Eutectic mubisanzwe bivangwa nibikoresho bibiri kubushyuhe runaka. Ibikoresho bisanzwe bikoreshwa birimo zahabu na tini, zahabu na silikoni, nibindi. Iyo ukoresheje inzira yo guhuza eutectic, inzira yo kohereza inzira aho ikariso iyobora iherereye mbere yo gushyushya ikadiri. Urufunguzo rwo kumenya uburyo bwo guhuza ibikorwa bya eutectic ni uko ibikoresho bya eutectic bihuza bishobora gushonga ku bushyuhe buri munsi yubushyuhe bwibikoresho byombi bigize ubumwe. Kugirango wirinde ikadiri kuba okiside mugihe cyo guhuza eutectic, inzira yo guhuza eutectic nayo ikoresha kenshi imyuka ikingira nka hydrogène na gaze ya azote ivanze kugirango yinjizwe mumurongo kugirango irinde ikiyobora.
2. 4 Uburyo bworoshye bwo kugurisha
Iyo kugurisha byoroshye kugurisha, mbere yo gushyira chip, umwanya uhuza kumurongo wambere urategekwa kandi ugakanda, cyangwa ugahagarikwa kabiri, kandi ikariso ikeneye gushyukwa mumurongo. Ibyiza byo kugurisha byoroshye kugurisha nuburyo bwiza bwo gutwara ibintu, kandi ibibi ni uko byoroshye okiside kandi inzira iragoye. Irakwiranye no kuyobora ikariso yububiko bwibikoresho byingufu, nka transistor outline packaging.
2. 5 Gahunda yo guhuza ifeza
Inzira itanga ibyiringiro byinshi kuri chip ya semiconductor ya generation ya gatatu iriho ubu ni ugukoresha tekinoroji yo gucumura ibyuma, ivanga polymers nka epoxy resin ishinzwe guhuza kashe ya kiyobora. Ifite amashanyarazi meza cyane, amashanyarazi, hamwe nubushyuhe bwo hejuru buranga serivisi. Nubuhanga kandi bwingenzi kugirango habeho gutera imbere mu gisekuru cya gatatu cya semiconductor bapakira mumyaka yashize.
2.6 Inzira yo guhuza Thermocompression
Mubikoresho byo gupakira byimikorere-yimikorere itatu-igizwe ninzitizi zuzuzanya, kubera kugabanuka guhoraho kwa chip interconnect yinjiza / ibisohoka, ubunini bwa bump hamwe na pitch, isosiyete ikora imashini itangiza imashini ya Intel yatangije uburyo bwo guhuza thermocompression kubikorwa byiterambere bito bito bihuza, guhuza bito bump chip hamwe nikibanza cya 40 kugeza kuri 50 mm cyangwa ndetse na 10 mm. Igikoresho cyo guhuza Thermocompression gikwiranye na chip-to-wafer na chip-to-substrate. Nkibikorwa byihuta byintambwe nyinshi, uburyo bwo guhuza thermocompression buhura nibibazo mubibazo byo kugenzura inzira, nkubushyuhe butaringaniye hamwe no gushonga bidashobora kugurishwa kugurishwa rito. Mugihe cyo guhuza ubushyuhe, ubushyuhe, umuvuduko, umwanya, nibindi bigomba kuba byujuje ibisabwa kugenzura neza.
2.7 Flip chip yo guhuza inzira
Ihame rya flip chip yo guhuza ryerekanwe mubishusho 2. Uburyo bwa flip bukura chip muri wafer hanyuma ikayihindura 180 ° kugirango yimure chip. Umutwe wo kugurisha umutwe nozzle afata chip muburyo bwa flip, kandi icyerekezo cya chip kiri hepfo. Nyuma yo gusudira umutwe nozzle yimukiye hejuru yububiko bwa substrate, iramanuka kugirango ihuze kandi ikosore chip kuri substrate.
Flip chip packaging nubuhanga bugezweho bwa chip guhuza imiyoboro kandi byahindutse icyerekezo cyiterambere cyiterambere rya tekinoroji igezweho. Ifite ibiranga ubucucike bukabije, imikorere ihanitse, yoroheje kandi ngufi, kandi irashobora kuzuza ibisabwa byiterambere ryibicuruzwa bya elegitoroniki byabaguzi nka terefone na tableti. Uburyo bwa flip chip buhuza butuma ibiciro bipfunyika bigabanuka kandi birashobora gutahura chip hamwe nibipapuro bitatu. Irakoreshwa cyane mubipfunyika byikoranabuhanga nka 2.5D / 3D bipakiye, bipfunyika urwego rwa wafer, hamwe na sisitemu yo murwego. Uburyo bwa flip chip buhuza nuburyo bukoreshwa cyane kandi bukoreshwa cyane muburyo bukomeye bwo gupfa muburyo bwa tekinoroji yo gupakira.
Igihe cyo kohereza: Ugushyingo-18-2024