2 ~ 6 cm 4 ° off-angle P-ubwoko bwa 4H-SiC substrate

Ibisobanuro bigufi:

‌4 ° off-angle P-type 4H-SiC substrate‌ ni ibikoresho byihariye bya semiconductor, aho “4 ° off-angle” bivuga icyerekezo cya kristu cyerekezo cya wafer kikaba dogere 4 zitari inguni, naho “P-ubwoko” bivuga ubwoko bwimikorere ya semiconductor. Ibi bikoresho bifite akamaro gakomeye mubikorwa bya semiconductor, cyane cyane mubijyanye na electronics power na electronics nyinshi.


Ibicuruzwa birambuye

Ibicuruzwa

Semicera ya 2 ~ 6 inch 4 ° off-angle P-4H-SiC substrate yakozwe kugirango ihuze ibyifuzo bikenerwa ningufu zikora cyane hamwe nabakora ibikoresho bya RF. Icyerekezo cya 4 ° kitari inguni zituma imikurire ya epitaxial igenda neza, bigatuma iyi substrate iba umusingi mwiza wibikoresho bitandukanye bya semiconductor, harimo MOSFETs, IGBTs, na diode.

Iyi santimetero 2 ~ 6 cm 4 ° off-angle P-4H-SiC substrate ifite ibintu byiza cyane, harimo nubushyuhe bwo hejuru bwumuriro, amashanyarazi meza, hamwe nubukanishi bukomeye. Icyerekezo cya off-angle gifasha kugabanya ubucucike bwa micropipe kandi bigateza imbere epitaxial layer yoroshye, ningirakamaro mugutezimbere imikorere nubwizerwe bwigikoresho cya nyuma cya semiconductor.

Semicera ya 2 ~ 6 inch 4 ° off-angle P-4H-SiC substrates iraboneka muburyo butandukanye bwa diametre, kuva kuri santimetero 2 kugeza kuri santimetero 6, kugirango zuzuze ibisabwa bitandukanye byo gukora. Substrates zacu zakozwe neza kugirango zitange urwego rumwe rwa doping hamwe nibiranga ubuziranenge bwo hejuru, byemeza ko buri wafer yujuje ibyangombwa bisabwa bikenewe muburyo bwa elegitoroniki.

Semicera yiyemeje guhanga udushya nubuziranenge iremeza ko 2 ~ 6 inch 4 ° off-angle P-4H-SiC substrates itanga imikorere ihamye mubikorwa byinshi biva mubikorwa bya elegitoroniki kugeza kubikoresho byihuta cyane. Iki gicuruzwa gitanga igisubizo cyizewe kubisekuru bizaza bikoresha ingufu, bikora neza cyane, bikoresha iterambere ryikoranabuhanga mu nganda nkimodoka, itumanaho, ningufu zishobora kubaho.

Ingano ijyanye nubunini

Ingano 2inch 4inch
Diameter 50.8 mm ± 0.38 mm 100.0 mm + 0 / -0.5 mm
Ubuso 4 ° yerekeza kuri <11-20> ± 0.5 ° 4 ° yerekeza kuri <11-20> ± 0.5 °
Uburebure bwibanze 16.0 mm ± 1.5mm 32.5mm ± 2mm
Uburebure bwa kabiri 8.0 mm ± 1.5mm 18.0 mm ± 2 mm
Icyerekezo Cyibanze Kuringaniza <11-20> ± 5.0 ° Kuringaniza <11-20> ± 5.0c
Icyerekezo cya kabiri cya Flat 90 ° CW kuva primaire ± 5.0 °, silicon ireba hejuru 90 ° CW kuva primaire ± 5.0 °, silicon ireba hejuru
Kurangiza C-Isura: Igipolonye cyiza, Si-Isura: CMP C-Isura: OpticalPolish, Si-Isura: CMP
Wafer Edge Beveling Beveling
Ubuso Si-Isura Ra <0.2 nm Si-Isura Ra <0.2nm
Umubyimba 350.0 ± 25.0um 350.0 ± 25.0um
Polytype 4H 4H
Doping p-Ubwoko p-Ubwoko

Ingano ijyanye nubunini

Ingano 6inch
Diameter 150.0 mm + 0 / -0.2 mm
Icyerekezo cy'ubuso 4 ° yerekeza kuri <11-20> ± 0.5 °
Uburebure bwibanze 47.5 mm ± 1.5mm
Uburebure bwa kabiri Nta na kimwe
Icyerekezo Cyibanze Bisa na <11-20> ± 5.0 °
Icyerekezo cya kabiri 90 ° CW kuva primaire ± 5.0 °, silicon ireba hejuru
Kurangiza C-Isura: Igipolonye cyiza, Si-Isura: CMP
Wafer Edge Beveling
Ubuso Si-Isura Ra <0.2 nm
Umubyimba 350.0 ± 25.0μm
Polytype 4H
Doping p-Ubwoko

Raman

2-6 santimetero 4 ° kuruhande-P-ubwoko bwa 4H-SiC substrate-3

Gukata umurongo

2-6 santimetero 4 ° kuruhande-P-4H-SiC substrate-4

Ubucucike bwa Dislocation (KOH etching)

2-6 cm 4 ° off-angle P-ubwoko bwa 4H-SiC substrate-5

KOH amashusho

2-6 santimetero 4 ° kuruhande-P-ubwoko bwa 4H-SiC substrate-6
SiC wafers

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