3C-SiC Wafer Substrate

Ibisobanuro bigufi:

Semicera 3C-SiC Wafer Substrates itanga ubushyuhe bwumuriro mwinshi hamwe n’umuriro mwinshi w’amashanyarazi, nibyiza kubikoresho bya elegitoroniki nibikoresho byihuta cyane. Izi nteruro zakozwe neza kugirango zikore neza ahantu habi, byemeza kwizerwa no gukora neza. Hitamo Semicera kubisubizo bishya kandi bigezweho.


Ibicuruzwa birambuye

Ibicuruzwa

Semicera 3C-SiC Wafer Substrates yakozwe kugirango itange urubuga rukomeye rwibisekuruza bizakurikiraho nibikoresho bya elegitoroniki. Hamwe nubushuhe buhebuje bwumuriro nibiranga amashanyarazi, izi substrate zakozwe kugirango zuzuze ibisabwa byubuhanga bugezweho.

Imiterere ya 3C-SiC (Cubic Silicon Carbide) ya Semicera Wafer Substrates itanga ibyiza byihariye, harimo nubushyuhe bwo hejuru bwumuriro hamwe na coefficient yo kwagura ubushyuhe buke ugereranije nibindi bikoresho bya semiconductor. Ibi bituma bahitamo neza kubikoresho bikora munsi yubushyuhe bukabije nubushobozi bukomeye.

Hamwe n’amashanyarazi maremare yamashanyarazi hamwe nubushakashatsi buhanitse, Semicera 3C-SiC Wafer Substrates itanga imikorere irambye kandi yizewe. Iyi miterere irakenewe mubisabwa nka radar-yumurongo mwinshi, urumuri rukomeye-rumuri, hamwe nimbaraga zihindura, aho gukora no kuramba byingenzi.

Ubwitange bwa Semicera bufite ireme bugaragarira mubikorwa byogukora neza bya 3C-SiC Wafer Substrates, bigatuma uburinganire n'ubwuzuzanye muri buri cyiciro. Ubu busobanuro bugira uruhare mubikorwa rusange no kuramba kubikoresho bya elegitoroniki byubakiyeho.

Muguhitamo Semicera 3C-SiC Wafer Substrates, abayikora babona uburyo bugezweho butuma iterambere ryibikoresho bito, byihuse, kandi bikora neza. Semicera ikomeje gushyigikira udushya mu ikoranabuhanga itanga ibisubizo byizewe byujuje ibyifuzo bigenda byiyongera byinganda ziciriritse.

Ibintu

Umusaruro

Ubushakashatsi

Dummy

Ibipimo bya Crystal

Polytype

4H

Ikosa ryerekana icyerekezo

<11-20> 4 ± 0.15 °

Ibipimo by'amashanyarazi

Dopant

Ubwoko bwa Azote

Kurwanya

0.015-0.025ohm · cm

Ibipimo bya mashini

Diameter

150.0 ± 0.2mm

Umubyimba

350 ± 25 mm

Icyerekezo cyibanze

[1-100] ± 5 °

Uburebure bwibanze

47.5 ± 1.5mm

Igice cya kabiri

Nta na kimwe

TTV

≤5 mm

≤10 mm

≤15 mm

LTV

≤3 μm (5mm * 5mm)

≤5 μm (5mm * 5mm)

≤10 μ m (5mm * 5mm)

Umuheto

-15 mm ~ 15 mm

-35μm ~ 35μm

-45μm ~ 45μm

Intambara

≤35 mm

≤45 mm

≤55 mm

Imbere (Si-face) ubukana (AFM)

Ra≤0.2nm (5μm * 5μm)

Imiterere

Ubucucike bwa Micropipe

<1 ea / cm2

<10 ea / cm2

<15 ea / cm2

Umwanda

≤5E10atoms / cm2

NA

BPD

≤1500 ea / cm2

0003000 ea / cm2

NA

TSD

≤500 ea / cm2

0001000 ea / cm2

NA

Ubwiza bw'imbere

Imbere

Si

Kurangiza

Si-face CMP

Ibice

≤60ea / wafer (ubunini≥0.3μm)

NA

Igishushanyo

≤5ea / mm. Uburebure bwuzuye ≤Ibipimo

Uburebure bwuzuye≤2 * Diameter

NA

Igishishwa cya orange / ibyobo / ikizinga / imirongo / ibice / kwanduza

Nta na kimwe

NA

Imipira yimpande / ibyerekana / kuvunika / isahani

Nta na kimwe

Agace ka polytype

Nta na kimwe

Agace kegeranye ≤20%

Agace kegeranye ≤30%

Ikimenyetso cya laser imbere

Nta na kimwe

Inyuma Yinyuma

Kurangiza

C-isura CMP

Igishushanyo

≤5ea / mm, Uburebure bwa Cumulative≤2 * Diameter

NA

Inenge zinyuma (chips / indents)

Nta na kimwe

Inyuma yinyuma

Ra≤0.2nm (5μm * 5μm)

Ikimenyetso cya laser inyuma

Mm 1 (uhereye hejuru)

Impande

Impande

Chamfer

Gupakira

Gupakira

Epi-yiteguye hamwe no gupakira vacuum

Gupakira cassette nyinshi

* Inyandiko : "NA" bivuze ko nta cyifuzo Ibintu bitavuzwe bishobora kwerekeza kuri SEMI-STD.

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SiC wafers

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