8 Inch N-ubwoko bwa SiC Wafer

Ibisobanuro bigufi:

Semicera ya 8 Inch N yo mu bwoko bwa SiC Wafers ikozwe muburyo bugezweho bwo gukoresha ingufu za elegitoroniki nyinshi. Iyi wafers itanga ibikoresho byamashanyarazi nubushyuhe bwo hejuru, byemeza imikorere myiza mubidukikije. Semicera itanga udushya no kwizerwa mubikoresho bya semiconductor.


Ibicuruzwa birambuye

Ibicuruzwa

Semicera ya 8 Inch N yo mu bwoko bwa SiC Wafers iri ku isonga mu guhanga udushya twinshi, itanga urufatiro rukomeye rwo guteza imbere ibikoresho bya elegitoroniki bikora cyane. Iyi wafer yashizweho kugirango ihuze ibyifuzo bikenewe bya elegitoroniki igezweho, kuva amashanyarazi ya elegitoroniki kugeza kumirongo myinshi.

D-doping yo muri N ya wafers ya SiC yongerera ingufu amashanyarazi, bigatuma iba nziza muburyo butandukanye bwo gukoresha, harimo ingufu za diode, transistor, hamwe na amplifier. Ubushobozi buhebuje butuma imbaraga nke zitakaza kandi zigakora neza, zikaba zikomeye kubikoresho bikora kuri radiyo nini kandi murwego rwimbaraga.

Semicera ikoresha ubuhanga buhanitse bwo gukora kugirango ikore waferi ya SiC ifite ubuso budasanzwe nubusembwa buke. Uru rwego rwibisobanuro ningirakamaro mubisabwa bisaba imikorere ihamye kandi iramba, nko mu kirere, mu modoka, no mu itumanaho.

Kwinjiza Semicera ya 8 Inch N yo mu bwoko bwa SiC Wafers kumurongo wawe utanga umusingi wo gukora ibice bishobora kwihanganira ibidukikije bikaze nubushyuhe bwinshi. Iyi wafer irakenewe mubisabwa muguhindura ingufu, tekinoroji ya RF, nibindi bice bisaba.

Guhitamo Semicera ya 8 Inch N yo mu bwoko bwa SiC Wafers bisobanura gushora imari mubicuruzwa bihuza siyanse yo mu rwego rwo hejuru hamwe nubuhanga bwuzuye. Semicera yiyemeje guteza imbere ubushobozi bwa tekinoroji ya semiconductor, itanga ibisubizo byongera imikorere nubwizerwe bwibikoresho bya elegitoroniki.

Ibintu

Umusaruro

Ubushakashatsi

Dummy

Ibipimo bya Crystal

Polytype

4H

Ikosa ryerekana icyerekezo

<11-20> 4 ± 0.15 °

Ibipimo by'amashanyarazi

Dopant

Ubwoko bwa Azote

Kurwanya

0.015-0.025ohm · cm

Ibipimo bya mashini

Diameter

150.0 ± 0.2mm

Umubyimba

350 ± 25 mm

Icyerekezo cyibanze

[1-100] ± 5 °

Uburebure bwibanze

47.5 ± 1.5mm

Igice cya kabiri

Nta na kimwe

TTV

≤5 mm

≤10 mm

≤15 mm

LTV

≤3 μm (5mm * 5mm)

≤5 μm (5mm * 5mm)

≤10 μ m (5mm * 5mm)

Umuheto

-15 mm ~ 15 mm

-35μm ~ 35μm

-45μm ~ 45μm

Intambara

≤35 mm

≤45 mm

≤55 mm

Imbere (Si-face) ubukana (AFM)

Ra≤0.2nm (5μm * 5μm)

Imiterere

Ubucucike bwa Micropipe

<1 ea / cm2

<10 ea / cm2

<15 ea / cm2

Umwanda

≤5E10atoms / cm2

NA

BPD

≤1500 ea / cm2

0003000 ea / cm2

NA

TSD

≤500 ea / cm2

0001000 ea / cm2

NA

Ubwiza bw'imbere

Imbere

Si

Kurangiza

Si-face CMP

Ibice

≤60ea / wafer (ubunini≥0.3μm)

NA

Igishushanyo

≤5ea / mm. Uburebure bwuzuye ≤Ibipimo

Uburebure bwuzuye≤2 * Diameter

NA

Igishishwa cya orange / ibyobo / ikizinga / imirongo / ibice / kwanduza

Nta na kimwe

NA

Imipira yimpande / ibyerekana / kuvunika / isahani

Nta na kimwe

Agace ka polytype

Nta na kimwe

Agace kegeranye ≤20%

Agace kegeranye ≤30%

Ikimenyetso cya laser imbere

Nta na kimwe

Inyuma Yinyuma

Kurangiza

C-isura CMP

Igishushanyo

≤5ea / mm, Uburebure bwa Cumulative≤2 * Diameter

NA

Inenge zinyuma (chips / indents)

Nta na kimwe

Inyuma yinyuma

Ra≤0.2nm (5μm * 5μm)

Ikimenyetso cya laser inyuma

Mm 1 (uhereye hejuru)

Impande

Impande

Chamfer

Gupakira

Gupakira

Epi-yiteguye hamwe no gupakira vacuum

Gupakira cassette nyinshi

* Inyandiko : "NA" bivuze ko nta cyifuzo Ibintu bitavuzwe bishobora kwerekeza kuri SEMI-STD.

tekinoroji_1_2_size
SiC wafers

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