P-Ubwoko bwa SiC Substrate Wafer

Ibisobanuro bigufi:

Semicera ya P yo mu bwoko bwa SiC Substrate Wafer ikozwe muburyo bwa elegitoroniki na optoelectronic progaramu. Iyi wafer itanga imiyoboro idasanzwe hamwe nubushyuhe bwumuriro, bigatuma iba nziza kubikoresho bikora neza. Hamwe na Semicera, tegereza neza kandi byizewe muri P-ubwoko bwa SiC substrate wafers.


Ibicuruzwa birambuye

Ibicuruzwa

Semicera ya P yo mu bwoko bwa SiC Substrate Wafer nigice cyingenzi mugutezimbere ibikoresho bya elegitoroniki na optoelectronic. Izi waferi zabugenewe kugirango zitange imikorere yongerewe imbaraga mumbaraga nyinshi nubushyuhe bwo hejuru, bifasha kwiyongera kubintu bikenewe kandi biramba.

Ubwoko bwa P-doping muri wafers yacu ya SiC itanga uburyo bwiza bwo gutwara amashanyarazi no gutwara ibicuruzwa bitwara. Ibi bituma bikenerwa cyane cyane mubisabwa muri electronics power, LEDs, na Photovoltaic selile, aho gutakaza ingufu nke no gukora neza birakomeye.

Yakozwe hamwe nubuziranenge bwo hejuru kandi bwuzuye, Semicera ya P yo mu bwoko bwa P ya SiC itanga uburinganire buhebuje hamwe nubunini buke. Ibi biranga ni ingenzi mu nganda aho guhuzagurika no kwizerwa ari ngombwa, nk'ikirere, ibinyabiziga, ndetse n'ingufu zishobora kongera ingufu.

Ubwitange bwa Semicera mu guhanga udushya no kuba indashyikirwa bugaragarira mu bwoko bwa P-SiC Substrate Wafer. Muguhuza ibyo byuma mubikorwa byumusaruro wawe, uremeza ko ibikoresho byawe byungukira kumiterere idasanzwe yubushyuhe n amashanyarazi ya SiC, ibafasha gukora neza mubihe bitoroshye.

Gushora imari muri P-ubwoko bwa SiC Substrate Wafer bisobanura guhitamo ibicuruzwa bihuza siyanse yubumenyi bugezweho nubuhanga bwitondewe. Semicera yitangiye gushyigikira igisekuru kizaza cya tekinoroji ya elegitoroniki na optoelectronic, itanga ibice byingenzi bikenewe kugirango ugere ku ntsinzi yawe munganda.

Ibintu

Umusaruro

Ubushakashatsi

Dummy

Ibipimo bya Crystal

Polytype

4H

Ikosa ryerekana icyerekezo

<11-20> 4 ± 0.15 °

Ibipimo by'amashanyarazi

Dopant

Ubwoko bwa Azote

Kurwanya

0.015-0.025ohm · cm

Ibipimo bya mashini

Diameter

150.0 ± 0.2mm

Umubyimba

350 ± 25 mm

Icyerekezo cyibanze

[1-100] ± 5 °

Uburebure bwibanze

47.5 ± 1.5mm

Igice cya kabiri

Nta na kimwe

TTV

≤5 mm

≤10 mm

≤15 mm

LTV

≤3 μm (5mm * 5mm)

≤5 μm (5mm * 5mm)

≤10 μ m (5mm * 5mm)

Umuheto

-15 mm ~ 15 mm

-35μm ~ 35μm

-45μm ~ 45μm

Intambara

≤35 mm

≤45 mm

≤55 mm

Imbere (Si-face) ubukana (AFM)

Ra≤0.2nm (5μm * 5μm)

Imiterere

Ubucucike bwa Micropipe

<1 ea / cm2

<10 ea / cm2

<15 ea / cm2

Umwanda

≤5E10atoms / cm2

NA

BPD

≤1500 ea / cm2

0003000 ea / cm2

NA

TSD

≤500 ea / cm2

0001000 ea / cm2

NA

Ubwiza bw'imbere

Imbere

Si

Kurangiza

Si-face CMP

Ibice

≤60ea / wafer (ubunini≥0.3μm)

NA

Igishushanyo

≤5ea / mm. Uburebure bwuzuye ≤Ibipimo

Uburebure bwuzuye≤2 * Diameter

NA

Igishishwa cya orange / ibyobo / ikizinga / imirongo / ibice / kwanduza

Nta na kimwe

NA

Imipira yimpande / ibyerekana / kuvunika / isahani

Nta na kimwe

Agace ka polytype

Nta na kimwe

Agace kegeranye ≤20%

Agace kegeranye ≤30%

Ikimenyetso cya laser imbere

Nta na kimwe

Inyuma Yinyuma

Kurangiza

C-isura CMP

Igishushanyo

≤5ea / mm, Uburebure bwa Cumulative≤2 * Diameter

NA

Inenge zinyuma (chips / indents)

Nta na kimwe

Inyuma yinyuma

Ra≤0.2nm (5μm * 5μm)

Ikimenyetso cya laser inyuma

Mm 1 (uhereye hejuru)

Impande

Impande

Chamfer

Gupakira

Gupakira

Epi-yiteguye hamwe no gupakira vacuum

Gupakira cassette nyinshi

* Inyandiko : "NA" bivuze ko nta cyifuzo Ibintu bitavuzwe bishobora kwerekeza kuri SEMI-STD.

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SiC wafers

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