Silicon Kuri Wafer

Ibisobanuro bigufi:

Silicon ya Silicon On Insulator (SOI) Wafer itanga amashanyarazi adasanzwe hamwe nubuyobozi bwumuriro kubikorwa byinshi. Yashizweho kugirango itange ibikoresho byiza kandi byizewe, iyi wafer ni ihitamo ryambere rya tekinoroji ya kijyambere. Hitamo Semicera yo gukata SOI wafer ibisubizo.


Ibicuruzwa birambuye

Ibicuruzwa

Silicon ya Silicon On Insulator (SOI) Wafer iri ku isonga mu guhanga udushya twa semiconductor, itanga ingufu zo kwigunga no gukora neza cyane. Imiterere ya SOI, igizwe na silicon yoroheje kurwego rwo hejuru, itanga inyungu zikomeye kubikoresho bya elegitoroniki bikora cyane.

Wafers yacu ya SOI yagenewe kugabanya ubushobozi bwa parasitike nubushobozi bwo gutemba, nibyingenzi mugutezimbere umuvuduko mwinshi kandi ufite ingufu nkeya. Iri koranabuhanga ryateye imbere ryemeza ko ibikoresho bikora neza, hamwe n'umuvuduko wihuse kandi bikagabanya gukoresha ingufu, byingenzi kuri electronics zigezweho.

Ibikorwa byiterambere byateye imbere bikoreshwa na Semicera byemeza umusaruro wa SOI wafers hamwe nuburinganire buhebuje. Iyi miterere ningirakamaro mubisabwa mu itumanaho, mu modoka, no mu bikoresho bya elegitoroniki, aho bisabwa ibice byizewe kandi bikora neza.

Usibye inyungu zabo z'amashanyarazi, wafers ya SOI ya Semicera itanga ubushyuhe bwo hejuru bwumuriro, bikongerera ubushyuhe no gutuza mumashanyarazi menshi kandi afite ingufu nyinshi. Iyi mikorere ifite agaciro cyane mubikorwa birimo kubyara ubushyuhe bukomeye kandi bisaba gucunga neza ubushyuhe.

Muguhitamo Silicon ya Silicon Kuri Insulator Wafer, ushora mubicuruzwa bishyigikira iterambere ryikoranabuhanga rigezweho. Twiyemeje ubuziranenge no guhanga udushya twerekana ko wafers yacu ya SOI yujuje ibyifuzo bikenerwa ninganda zikoresha amashanyarazi muri iki gihe, bitanga umusingi wibikoresho bya elegitoroniki bizaza.

Ibintu

Umusaruro

Ubushakashatsi

Dummy

Ibipimo bya Crystal

Polytype

4H

Ikosa ryerekana icyerekezo

<11-20> 4 ± 0.15 °

Ibipimo by'amashanyarazi

Dopant

Ubwoko bwa Azote

Kurwanya

0.015-0.025ohm · cm

Ibipimo bya mashini

Diameter

150.0 ± 0.2mm

Umubyimba

350 ± 25 mm

Icyerekezo cyibanze

[1-100] ± 5 °

Uburebure bwibanze

47.5 ± 1.5mm

Igice cya kabiri

Nta na kimwe

TTV

≤5 mm

≤10 mm

≤15 mm

LTV

≤3 μm (5mm * 5mm)

≤5 μm (5mm * 5mm)

≤10 μ m (5mm * 5mm)

Umuheto

-15 mm ~ 15 mm

-35μm ~ 35μm

-45μm ~ 45μm

Intambara

≤35 mm

≤45 mm

≤55 mm

Imbere (Si-face) ubukana (AFM)

Ra≤0.2nm (5μm * 5μm)

Imiterere

Ubucucike bwa Micropipe

<1 ea / cm2

<10 ea / cm2

<15 ea / cm2

Umwanda

≤5E10atoms / cm2

NA

BPD

≤1500 ea / cm2

0003000 ea / cm2

NA

TSD

≤500 ea / cm2

0001000 ea / cm2

NA

Ubwiza bw'imbere

Imbere

Si

Kurangiza

Si-face CMP

Ibice

≤60ea / wafer (ubunini≥0.3μm)

NA

Igishushanyo

≤5ea / mm. Uburebure bwuzuye ≤Ibipimo

Uburebure bwuzuye≤2 * Diameter

NA

Igishishwa cya orange / ibyobo / ikizinga / imirongo / ibice / kwanduza

Nta na kimwe

NA

Imipira yimpande / ibyerekana / kuvunika / isahani

Nta na kimwe

Agace ka polytype

Nta na kimwe

Agace kegeranye ≤20%

Agace kegeranye ≤30%

Ikimenyetso cya laser imbere

Nta na kimwe

Inyuma Yinyuma

Kurangiza

C-isura CMP

Igishushanyo

≤5ea / mm, Uburebure bwa Cumulative≤2 * Diameter

NA

Inenge zinyuma (chips / indents)

Nta na kimwe

Inyuma yinyuma

Ra≤0.2nm (5μm * 5μm)

Ikimenyetso cya laser inyuma

Mm 1 (uhereye hejuru)

Impande

Impande

Chamfer

Gupakira

Gupakira

Epi-yiteguye hamwe no gupakira vacuum

Gupakira cassette nyinshi

* Inyandiko : "NA" bivuze ko nta cyifuzo Ibintu bitavuzwe bishobora kwerekeza kuri SEMI-STD.

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SiC wafers

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