Silicon kuri Wafers ya Insulatorkuva muri Semicera byashizweho kugirango bihuze ibyifuzo byiyongera kubisubizo bihanitse bya semiconductor. Wafers yacu ya SOI itanga imikorere yamashanyarazi kandi igabanya ubushobozi bwa parasitike yububiko, bigatuma iba nziza kubikorwa byiterambere nkibikoresho bya MEMS, sensor, hamwe na sisitemu ihuriweho. Ubuhanga bwa Semicera mubikorwa bya wafer byemeza ko buriweseSOI waferitanga ibisubizo byizewe, byujuje ubuziranenge kubisekuruza bizaza bikenewe.
IwacuSilicon kuri Wafers ya Insulatortanga impirimbanyi nziza hagati yikiguzi-cyiza nigikorwa. Hamwe nigiciro cya soi wafer igenda irushanwa, izi wafer zikoreshwa cyane mubikorwa bitandukanye, harimo mikorobe na optoelectronics. Uburyo bwa Semicera butanga umusaruro ushimishije butanga ubwuzuzanye bwa wafer hamwe nuburinganire, bigatuma bukoreshwa muburyo butandukanye, kuva muri cavity SOI wafers kugeza kuri wafer isanzwe ya silicon.
Ibintu by'ingenzi:
•Wafers yo mu rwego rwohejuru ya SOI yatunganijwe neza kugirango ikore muri MEMS nibindi bikorwa.
•Irushanwa rya soi wafer irushanwa kubucuruzi bashaka ibisubizo byiterambere bitabangamiye ubuziranenge.
•Icyifuzo cya tekinoroji igezweho, itanga ingufu zo kwigunga no gukora neza muri silicon kuri sisitemu ya insulator.
IwacuSilicon kuri Wafers ya Insulatorzashizweho kugirango zitange ibisubizo bihanitse, bishyigikira ubutaha bwo guhanga udushya muri tekinoroji ya semiconductor. Niba ukora kuri cavitySOI wafers, Ibikoresho bya MEMS, cyangwa silicon kubice bigize insulator, Semicera itanga wafer yujuje ubuziranenge murwego rwo hejuru.
| Ibintu | Umusaruro | Ubushakashatsi | Dummy |
| Ibipimo bya Crystal | |||
| Polytype | 4H | ||
| Ikosa ryerekana icyerekezo | <11-20> 4 ± 0.15 ° | ||
| Ibipimo by'amashanyarazi | |||
| Dopant | Ubwoko bwa Azote | ||
| Kurwanya | 0.015-0.025ohm · cm | ||
| Ibipimo bya mashini | |||
| Diameter | 150.0 ± 0.2mm | ||
| Umubyimba | 350 ± 25 mm | ||
| Icyerekezo cyibanze | [1-100] ± 5 ° | ||
| Uburebure bwibanze | 47.5 ± 1.5mm | ||
| Igice cya kabiri | Nta na kimwe | ||
| TTV | ≤5 mm | ≤10 mm | ≤15 mm |
| LTV | ≤3 μm (5mm * 5mm) | ≤5 μm (5mm * 5mm) | ≤10 μ m (5mm * 5mm) |
| Umuheto | -15 mm ~ 15 mm | -35μm ~ 35μm | -45μm ~ 45μm |
| Intambara | ≤35 mm | ≤45 mm | ≤55 mm |
| Imbere (Si-face) ubukana (AFM) | Ra≤0.2nm (5μm * 5μm) | ||
| Imiterere | |||
| Ubucucike bwa Micropipe | <1 ea / cm2 | <10 ea / cm2 | <15 ea / cm2 |
| Umwanda | ≤5E10atoms / cm2 | NA | |
| BPD | ≤1500 ea / cm2 | 0003000 ea / cm2 | NA |
| TSD | ≤500 ea / cm2 | 0001000 ea / cm2 | NA |
| Ubwiza bw'imbere | |||
| Imbere | Si | ||
| Kurangiza | Si-face CMP | ||
| Ibice | ≤60ea / wafer (ubunini≥0.3μm) | NA | |
| Igishushanyo | ≤5ea / mm. Uburebure bwuzuye ≤Ibipimo | Uburebure bwuzuye≤2 * Diameter | NA |
| Igishishwa cya orange / ibyobo / ikizinga / imirongo / ibice / kwanduza | Nta na kimwe | NA | |
| Imipira yimpande / ibyerekana / kuvunika / isahani | Nta na kimwe | ||
| Agace ka polytype | Nta na kimwe | Agace kegeranye ≤20% | Agace kegeranye ≤30% |
| Ikimenyetso cya laser imbere | Nta na kimwe | ||
| Inyuma Yinyuma | |||
| Kurangiza | C-isura CMP | ||
| Igishushanyo | ≤5ea / mm, Uburebure bwa Cumulative≤2 * Diameter | NA | |
| Inenge zinyuma (chips / indents) | Nta na kimwe | ||
| Inyuma yinyuma | Ra≤0.2nm (5μm * 5μm) | ||
| Ikimenyetso cya laser inyuma | Mm 1 (uhereye hejuru) | ||
| Impande | |||
| Impande | Chamfer | ||
| Gupakira | |||
| Gupakira | Epi-yiteguye hamwe no gupakira vacuum Gupakira cassette nyinshi | ||
| * Inyandiko ： "NA" bivuze ko nta cyifuzo Ibintu bitavuzwe bishobora kwerekeza kuri SEMI-STD. | |||
