Semicera yerekana inganda ziyoboraAbatwara Wafer, yashizweho kugirango itange uburinzi buhebuje hamwe nogutwara nta nkomyi ya waferi yoroheje ya semiconductor mu byiciro bitandukanye byuburyo bwo gukora. IwacuAbatwara WaferByashizweho muburyo bwitondewe kugirango bihuze ibyifuzo bikenerwa byo guhimba semiconductor igezweho, byemeza ubunyangamugayo nubuziranenge bwa wafer yawe ikomeza igihe cyose.
Ibintu by'ingenzi:
• Kubaka ibikoresho bihebuje:Yakozwe mu bikoresho byo mu rwego rwo hejuru, birwanya kwanduza byemeza kuramba no kuramba, bigatuma biba byiza mu bidukikije.
•Igishushanyo mbonera:Ibiranga neza guhuza ahantu hamwe nuburyo bwo gufata neza kugirango wirinde kunyerera no kwangirika mugihe cyo gutwara no gutwara.
•Guhuza byinshi:Yakira intera nini yubunini bwa wafer nubunini, itanga ihinduka ryimikorere itandukanye ya semiconductor.
•Gukemura ibibazo bya Ergonomic:Igishushanyo cyoroheje kandi cyorohereza abakoresha cyorohereza gupakira no gupakurura byoroshye, kuzamura imikorere no kugabanya igihe cyo gukora.
•Amahitamo yihariye:Tanga kwihitiramo kugirango wuzuze ibisabwa byihariye, harimo guhitamo ibikoresho, guhindura ingano, no gushyiramo ikimenyetso cyo guhuza ibikorwa neza.
Ongera ibikorwa byawe bya semiconductor hamwe na SemiceraAbatwara Wafer, igisubizo cyiza cyo kurinda wafers yawe kwanduza no kwangiza imashini. Wizere ko twiyemeje ubuziranenge no guhanga udushya kugirango dutange ibicuruzwa bitujuje gusa ariko birenze ibipimo byinganda, bituma ibikorwa byawe bigenda neza kandi neza.
| Ibintu | Umusaruro | Ubushakashatsi | Dummy |
| Ibipimo bya Crystal | |||
| Polytype | 4H | ||
| Ikosa ryerekana icyerekezo | <11-20> 4 ± 0.15 ° | ||
| Ibipimo by'amashanyarazi | |||
| Dopant | Ubwoko bwa Azote | ||
| Kurwanya | 0.015-0.025ohm · cm | ||
| Ibipimo bya mashini | |||
| Diameter | 150.0 ± 0.2mm | ||
| Umubyimba | 350 ± 25 mm | ||
| Icyerekezo cyibanze | [1-100] ± 5 ° | ||
| Uburebure bwibanze | 47.5 ± 1.5mm | ||
| Igice cya kabiri | Nta na kimwe | ||
| TTV | ≤5 mm | ≤10 mm | ≤15 mm |
| LTV | ≤3 μm (5mm * 5mm) | ≤5 μm (5mm * 5mm) | ≤10 μ m (5mm * 5mm) |
| Umuheto | -15 mm ~ 15 mm | -35μm ~ 35μm | -45μm ~ 45μm |
| Intambara | ≤35 mm | ≤45 mm | ≤55 mm |
| Imbere (Si-face) ubukana (AFM) | Ra≤0.2nm (5μm * 5μm) | ||
| Imiterere | |||
| Ubucucike bwa Micropipe | <1 ea / cm2 | <10 ea / cm2 | <15 ea / cm2 |
| Umwanda | ≤5E10atoms / cm2 | NA | |
| BPD | ≤1500 ea / cm2 | 0003000 ea / cm2 | NA |
| TSD | ≤500 ea / cm2 | 0001000 ea / cm2 | NA |
| Ubwiza bw'imbere | |||
| Imbere | Si | ||
| Kurangiza | Si-face CMP | ||
| Ibice | ≤60ea / wafer (ubunini≥0.3μm) | NA | |
| Igishushanyo | ≤5ea / mm. Uburebure bwuzuye ≤Ibipimo | Uburebure bwuzuye≤2 * Diameter | NA |
| Igishishwa cya orange / ibyobo / ikizinga / imirongo / ibice / kwanduza | Nta na kimwe | NA | |
| Imipira yimpande / ibyerekana / kuvunika / isahani | Nta na kimwe | ||
| Agace ka polytype | Nta na kimwe | Agace kegeranye ≤20% | Agace kegeranye ≤30% |
| Ikimenyetso cya laser imbere | Nta na kimwe | ||
| Inyuma Yinyuma | |||
| Kurangiza | C-isura CMP | ||
| Igishushanyo | ≤5ea / mm, Uburebure bwa Cumulative≤2 * Diameter | NA | |
| Inenge zinyuma (chips / indents) | Nta na kimwe | ||
| Inyuma yinyuma | Ra≤0.2nm (5μm * 5μm) | ||
| Ikimenyetso cya laser inyuma | Mm 1 (uhereye hejuru) | ||
| Impande | |||
| Impande | Chamfer | ||
| Gupakira | |||
| Gupakira | Epi-yiteguye hamwe no gupakira vacuum Gupakira cassette nyinshi | ||
| * Inyandiko ： "NA" bivuze ko nta cyifuzo Ibintu bitavuzwe bishobora kwerekeza kuri SEMI-STD. | |||
