Abatwara Wafer

Ibisobanuro bigufi:

Abatwara Wafer- Igisubizo cyizewe kandi cyiza cya wafer cyakozwe na Semicera, cyagenewe kurinda no gutwara waferi ya semiconductor hamwe nibisobanuro byuzuye kandi byizewe mubidukikije byateye imbere.


Ibicuruzwa birambuye

Ibicuruzwa

Semicera yerekana inganda ziyoboraAbatwara Wafer, yashizweho kugirango itange uburinzi buhebuje hamwe nogutwara nta nkomyi ya waferi yoroheje ya semiconductor mu byiciro bitandukanye byuburyo bwo gukora. IwacuAbatwara WaferByashizweho muburyo bwitondewe kugirango bihuze ibyifuzo bikenerwa byo guhimba semiconductor igezweho, byemeza ubunyangamugayo nubuziranenge bwa wafer yawe ikomeza igihe cyose.

 

Ibintu by'ingenzi:

• Ubwubatsi buhebuje:Yakozwe mu bikoresho byo mu rwego rwo hejuru, birwanya kwanduza byemeza kuramba no kuramba, bigatuma biba byiza mu bidukikije.

Igishushanyo mbonera:Ibiranga neza guhuza ahantu hamwe nuburyo bwo gufata neza kugirango wirinde kunyerera wafer no kwangirika mugihe cyo gutwara no gutwara.

Guhuza byinshi:Yakira intera nini yubunini bwa wafer nubunini, itanga ihinduka ryimikorere itandukanye ya semiconductor.

Gukemura ibibazo bya Ergonomic:Igishushanyo cyoroheje kandi cyorohereza abakoresha cyoroshya gupakira no gupakurura byoroshye, kuzamura imikorere no kugabanya igihe cyo gukora.

Amahitamo yihariye:Tanga kwihitiramo kugirango wuzuze ibisabwa byihariye, harimo guhitamo ibikoresho, guhindura ingano, no gushyiramo ikimenyetso cyo guhuza ibikorwa neza.

 

Ongera ibikorwa byawe bya semiconductor hamwe na SemiceraAbatwara Wafer, igisubizo cyiza cyo kurinda wafers yawe kwanduza no kwangiza imashini. Wizere ko twiyemeje ubuziranenge no guhanga udushya kugirango dutange ibicuruzwa bitujuje gusa ariko birenze ibipimo byinganda, bituma ibikorwa byawe bigenda neza kandi neza.

Ibintu

Umusaruro

Ubushakashatsi

Dummy

Ibipimo bya Crystal

Polytype

4H

Ikosa ryerekana icyerekezo

<11-20> 4 ± 0.15 °

Ibipimo by'amashanyarazi

Dopant

Ubwoko bwa Azote

Kurwanya

0.015-0.025ohm · cm

Ibipimo bya mashini

Diameter

150.0 ± 0.2mm

Umubyimba

350 ± 25 mm

Icyerekezo cyibanze

[1-100] ± 5 °

Uburebure bwibanze

47.5 ± 1.5mm

Igice cya kabiri

Nta na kimwe

TTV

≤5 mm

≤10 mm

≤15 mm

LTV

≤3 μm (5mm * 5mm)

≤5 μm (5mm * 5mm)

≤10 μ m (5mm * 5mm)

Umuheto

-15 mm ~ 15 mm

-35μm ~ 35μm

-45μm ~ 45μm

Intambara

≤35 mm

≤45 mm

≤55 mm

Imbere (Si-face) ubukana (AFM)

Ra≤0.2nm (5μm * 5μm)

Imiterere

Ubucucike bwa Micropipe

<1 ea / cm2

<10 ea / cm2

<15 ea / cm2

Umwanda

≤5E10atoms / cm2

NA

BPD

≤1500 ea / cm2

0003000 ea / cm2

NA

TSD

≤500 ea / cm2

0001000 ea / cm2

NA

Ubwiza bw'imbere

Imbere

Si

Kurangiza

Si-face CMP

Ibice

≤60ea / wafer (ubunini≥0.3μm)

NA

Igishushanyo

≤5ea / mm. Uburebure bwuzuye ≤Ibipimo

Uburebure bwuzuye≤2 * Diameter

NA

Igishishwa cya orange / ibyobo / ikizinga / imirongo / ibice / kwanduza

Nta na kimwe

NA

Imipira yimpande / ibyerekana / kuvunika / isahani

Nta na kimwe

Agace ka polytype

Nta na kimwe

Agace kegeranye ≤20%

Agace kegeranye ≤30%

Ikimenyetso cya laser imbere

Nta na kimwe

Inyuma Yinyuma

Kurangiza

C-isura CMP

Igishushanyo

≤5ea / mm, Uburebure bwa Cumulative≤2 * Diameter

NA

Inenge zinyuma (chips / indents)

Nta na kimwe

Inyuma yinyuma

Ra≤0.2nm (5μm * 5μm)

Ikimenyetso cya laser inyuma

Mm 1 (uhereye hejuru)

Impande

Impande

Chamfer

Gupakira

Gupakira

Epi-yiteguye hamwe no gupakira vacuum

Gupakira cassette nyinshi

* Inyandiko : "NA" bivuze ko nta cyifuzo Ibintu bitavuzwe bishobora kwerekeza kuri SEMI-STD.

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SiC wafers

  • Mbere:
  • Ibikurikira: