Cassette ya Wafer

Ibisobanuro bigufi:

Cassette ya Wafer- Byakozwe neza muburyo bwiza bwo gufata neza no kubika waferi ya semiconductor, kurinda umutekano nisuku neza mubikorwa byose.


Ibicuruzwa birambuye

Ibicuruzwa

Semicera'sCassette ya Waferni ikintu gikomeye mubikorwa byo gukora igice cya kabiri, cyagenewe gufata neza no gutwara waferi nziza ya semiconductor. UwitekaCassette ya Waferitanga uburinzi budasanzwe, yemeza ko buri wafer itarinze kwanduzwa no kwangirika kwumubiri mugihe cyo gutunganya, kubika, no gutwara.

Yubatswe hamwe nubuziranenge bwinshi, ibikoresho birwanya imiti, SemiceraCassette ya Waferyemeza urwego rwo hejuru rwisuku nigihe kirekire, nibyingenzi mukubungabunga ubusugire bwa wafer kuri buri cyiciro cyumusaruro. Ubwubatsi bwuzuye bwiyi kaseti butuma habaho guhuza hamwe na sisitemu yo gukoresha mu buryo bwikora, bigabanya ibyago byo kwanduza no kwangiza imashini.

Igishushanyo cyaCassette ya Wafernayo ishyigikira uburyo bwiza bwo guhumeka no kugenzura ubushyuhe, nibyingenzi mubikorwa bisaba ibidukikije byihariye. Byaba bikoreshwa mu bwiherero cyangwa mugihe cyo gutunganya ubushyuhe, SemiceraCassette ya Waferni injeniyeri kugirango ihuze ibyifuzo bikenerwa ninganda ziciriritse, zitanga imikorere yizewe kandi ihamye yo kuzamura imikorere nubuziranenge bwibicuruzwa.

Ibintu

Umusaruro

Ubushakashatsi

Dummy

Ibipimo bya Crystal

Polytype

4H

Ikosa ryerekana icyerekezo

<11-20> 4 ± 0.15 °

Ibipimo by'amashanyarazi

Dopant

Ubwoko bwa Azote

Kurwanya

0.015-0.025ohm · cm

Ibipimo bya mashini

Diameter

150.0 ± 0.2mm

Umubyimba

350 ± 25 mm

Icyerekezo cyibanze

[1-100] ± 5 °

Uburebure bwibanze

47.5 ± 1.5mm

Igice cya kabiri

Nta na kimwe

TTV

≤5 mm

≤10 mm

≤15 mm

LTV

≤3 μm (5mm * 5mm)

≤5 μm (5mm * 5mm)

≤10 μ m (5mm * 5mm)

Umuheto

-15 mm ~ 15 mm

-35μm ~ 35μm

-45μm ~ 45μm

Intambara

≤35 mm

≤45 mm

≤55 mm

Imbere (Si-face) ubukana (AFM)

Ra≤0.2nm (5μm * 5μm)

Imiterere

Ubucucike bwa Micropipe

<1 ea / cm2

<10 ea / cm2

<15 ea / cm2

Umwanda

≤5E10atoms / cm2

NA

BPD

≤1500 ea / cm2

0003000 ea / cm2

NA

TSD

≤500 ea / cm2

0001000 ea / cm2

NA

Ubwiza bw'imbere

Imbere

Si

Kurangiza

Si-face CMP

Ibice

≤60ea / wafer (ubunini≥0.3μm)

NA

Igishushanyo

≤5ea / mm. Uburebure bwuzuye ≤Ibipimo

Uburebure bwuzuye≤2 * Diameter

NA

Igishishwa cya orange / ibyobo / ikizinga / imirongo / ibice / kwanduza

Nta na kimwe

NA

Imipira yimpande / ibyerekana / kuvunika / isahani

Nta na kimwe

Agace ka polytype

Nta na kimwe

Agace kegeranye ≤20%

Agace kegeranye ≤30%

Ikimenyetso cya laser imbere

Nta na kimwe

Inyuma Yinyuma

Kurangiza

C-isura CMP

Igishushanyo

≤5ea / mm, Uburebure bwa Cumulative≤2 * Diameter

NA

Inenge zinyuma (chips / indents)

Nta na kimwe

Inyuma yinyuma

Ra≤0.2nm (5μm * 5μm)

Ikimenyetso cya laser inyuma

Mm 1 (uhereye hejuru)

Impande

Impande

Chamfer

Gupakira

Gupakira

Epi-yiteguye hamwe no gupakira vacuum

Gupakira cassette nyinshi

* Inyandiko : "NA" bivuze ko nta cyifuzo Ibintu bitavuzwe bishobora kwerekeza kuri SEMI-STD.

tekinoroji_1_2_size
SiC wafers

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