Ukuboko kwa Waferni ibikoresho byingenzi bikoreshwa mugukora igice cya kabiri cyogukora, kwimura no kumwanyawafers. Ubusanzwe igizwe nimbaraga za robo, gripper na sisitemu yo kugenzura, hamwe no kugenda neza hamwe nubushobozi bwo guhagarara.Wafer ukoresha intwarozikoreshwa cyane muburyo butandukanye mubikorwa bya semiconductor, harimo intambwe zikorwa nko gupakira wafer, gukora isuku, gushira firime yoroheje, kuroba, lithographie no kugenzura. Ubusobanuro bwayo, ubwizerwe nubushobozi bwikora nibyingenzi kugirango hamenyekane ubuziranenge, gukora neza no guhuza ibikorwa.
Ibikorwa byingenzi byamaboko ya wafer arimo:
1.
2. Umwanya uhagaze hamwe nicyerekezo: Ukuboko kwa wafer gushobora guhagarara neza no kwerekera wafer kugirango harebwe neza neza nu mwanya wo gutunganya cyangwa gupima ibikorwa.
3. Gufata no kurekura: Intwaro yo gukoresha Wafer isanzwe ifite ibyuma bifata ibyuma bishobora gufata neza waferi no kubirekura mugihe bikenewe kugirango habeho kwimurwa no gufata neza waferi.
4.
Ibiranga ibyiza
1.Ibipimo byerekana neza hamwe nubushyuhe bwumuriro.
2.Uburemere bukomeye hamwe nubushuhe buhebuje bwubushyuhe, gukoresha igihe kirekire ntabwo byoroshye kugoreka deformasiyo.
3.Bifite ubuso bunoze kandi birwanya kwambara neza, bityo bikore neza chip idafite ibice byanduye.
4.Silicon karbide irwanya 106-108Ω, itari magnetique, ijyanye nibisabwa na anti-ESD; Irashobora gukumira ikwirakwizwa ryamashanyarazi ahamye hejuru ya chip.
5.Ubushuhe bwiza bwumuriro, coefficente yo kwaguka.
